The CIPS Act, as this article is slow to point out, it just about chips, not packaging etc, which require two other companies processes both embedded primarily in China and Taiwan. Slowly, they are realizing that the Act is a money gab for the semiconductor industry (chips made in the US and the EU will be made in smaller fabs, will only cover a limited range of components and will therefore end up costing more – real estate and labor costs being problems).
Water shortages in the west and south of the USA, where most of the fabs are being built, make production difficult and there are also problems with water for staff and support services. Even though the fabs will be ‘water and carbon neutral’ (when I challenged TSMC on this they said ‘we’ll sort out the details later’), the infrastructure requirements will not be neutral and the shipping for packaging, leading etc has not been explained
[https://www.fierceelectronics.com/electronics/will-chips-act-be-effective-concerns-aired-sensors-converge-2023](https://www.fierceelectronics.com/electronics/will-chips-act-be-effective-concerns-aired-sensors-converge-2023)